Leading-edge Technology and Products
To be at the forefront of technology development, we have to overcome a variety of different challenges - from manufacturing high-quality products to implementing leading-edge manufacturing processes and fulfilling our responsibilities to the environment. Therefore, we constantly push the limits in technology and manufacturing and strive for the most environment-friendly processes.
VLSI White Paper:
Breakthrough to 30nm Generation with Buried Wordline Technology
"Moore´s Law" dictates that the number of transistors per square inch of silicon will double
nearly every two years. Shrinking the circuitry is a critical step in this development. With our
innovative
Buried Wordline
DRAM technology we announced recently a technology roadmap down to the 30nm generation and
featuring cell sizes of 4F².
This technology combines high performance, low power consumption and small chip sizes to further advance the company´s diversified product portfolio. Qimonda is introducing this leading edge technology now in 65nm and plans to begin production of 1 Gbit DDR2 in the second half of calendar 2008.
300mm Wafer Technology
300mm manufacturing provides significant efficiency gains as shrinkage proceeds. We are among
the leaders in the transition to manufacturing on 300mm wafers and, by utilizing four facilities,
we have one of the highest shares in 300mm manufacturing. Partnerships make a vital contribution to
our efforts to constantly increase our capacities in this area.
In addition to our wholly-owned 300mm fabs in Richmond (USA) and Dresden (Germany) we
manufacture 300mm wafers in our joint venture with Inotera in Taiwan and cooperate with the foundry
Winbond (Taiwan).